1079793 PHOENIX CONTACT - Technology Bsa

Notes	General: For module carrier frames HC-M-B...-MF-H/HC-M-B...-MF-B, for two conductors Connectors may be operated only when there is no load/voltage. The use of guide pins (HC-CST) and sockets (HC-CBU) is recommended to prevent tip collision due to misalignment.
Mounting	Assembly instructions: To ensure correct use, installation in housing with IP54 protection or better is required Connection method: Crimp connection
Product properties	Product type: Modular contact insert Number of positions: 9 Connection profile: 9 Contact numbering: 1 - 9 Application: Data Number of module slots: 1 Type: D-SUBÃ9 Contact material type: turned Series: HC-M-DSUB-C Insulation characteristics Overvoltage category: III Degree of pollution: 3
Connection data	Connection technology Connection technology: Crimp connection Conductor connection Conductor cross section: 0.09 mm² ... 0.82 mm² Connection cross section AWG: 28 ... 18 Stripping length of the individual wire: 4.2 mm
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/b15da12a17b0e044ac06e80df9d0932a/-S204x204-FJPG Width: 34.2 mm Height: 35.7 mm Length: 14.6 mm Mechanical characteristics Minimum housing height: 52 mm Contact diameter: 1 mm
Electrical properties	Rated voltage (III/3): 48 V Rated surge voltage: 0.8 kV Rated current: 5 A
Mechanical properties	Mechanical data Insertion/withdrawal cycles: Ã¢Ã¢°¥ 500
Material specifications	Material: Zinc alloy Flammability rating according to UL 94: V0 Contact material: Copper alloy Contact surface material: Ag Contact carrier material: PC
Environmental and real-life conditions	Ambient conditions Ambient temperature (operation): -40°C ... 125°C