Product Catalogue - Technology Bsa

PCB terminal block, nominal current: 32 A, rated voltage (III/2): 400 V, nominal cross section: 4 mm², number of potentials: 8, number of rows: 1, number of positions per row: 8, product range: SPT 2,5/..-V-THR, pitch: 5 mm, connection method: Push-in spring connection, mounting: THR soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 2.6 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 8, number of rows: 1, number of positions per row: 8, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 11, number of rows: 1, number of positions per row: 11, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 12, number of rows: 1, number of positions per row: 12, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 13, number of rows: 1, number of positions per row: 13, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 14, number of rows: 1, number of positions per row: 14, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 15, number of rows: 1, number of positions per row: 15, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 16, number of rows: 1, number of positions per row: 16, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 10, number of rows: 1, number of positions per row: 10, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: MKDS 1/..-HT, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: THR soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: MKDS 1/..-HT, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: THR soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard. This article can be soldered in the reflow furnace together with SMD components.

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 3, number of rows: 1, number of positions per row: 3, product range: MKDS 1/..-HT, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: THR soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard. This article can be soldered in the reflow furnace together with SMD components.

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: MKDS 1/..-HT, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: THR soldering, conductor/PCB connection direction: 0°, color: black, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: 24 mm wide tape

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 10, number of rows: 1, number of positions per row: 10, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: pastel green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 3, number of rows: 1, number of positions per row: 3, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: pastel green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 12, number of rows: 1, number of positions per row: 12, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: pastel green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 13, number of rows: 1, number of positions per row: 13, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: pastel green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 14, number of rows: 1, number of positions per row: 14, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: pastel green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard

PCB terminal block, nominal current: 13.5 A, rated voltage (III/2): 200 V, nominal cross section: 1.5 mm², number of potentials: 15, number of rows: 1, number of positions per row: 15, product range: BC-X9, pitch: 3.81 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: pastel green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, number of solder pins per potential: 1, type of packaging: packed in cardboard