Catalogo Prodotti - Technology Bsa

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 6, number of rows: 1, number of positions: 6, number of connections: 6, product range: MCV 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 44 mm wide tape, User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads"

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 7, number of rows: 1, number of positions: 7, number of connections: 7, product range: MCV 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 44 mm wide tape, User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads"

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 8, number of rows: 1, number of positions: 8, number of connections: 8, product range: MCV 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 44 mm wide tape, User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads"

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 9, number of rows: 1, number of positions: 9, number of connections: 9, product range: MCV 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 44 mm wide tape, User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads"

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 10, number of rows: 1, number of positions: 10, number of connections: 10, product range: MCV 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 44 mm wide tape, User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads"

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 11, number of rows: 1, number of positions: 11, number of connections: 11, product range: MCV 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 44 mm wide tape, User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads"

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 12, number of rows: 1, number of positions: 12, number of connections: 12, product range: MCV 0,5/..-G-THT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.5 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 44 mm wide tape, User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads"

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 24, number of rows: 2, number of positions: 12, number of connections: 24, product range: MCD 0,5/..-G1-HT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, Standard component made of highly temperature resistant plastic; suitable for reflow process. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads".

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 8, number of rows: 2, number of positions: 4, number of connections: 8, product range: MCD 0,5/..-G1-HT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, Standard component made of highly temperature resistant plastic; suitable for reflow process. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads".

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 10, number of rows: 2, number of positions: 5, number of connections: 10, product range: MCD 0,5/..-G1-HT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, Standard component made of highly temperature resistant plastic; suitable for reflow process. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads".

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 12, number of rows: 2, number of positions: 6, number of connections: 12, product range: MCD 0,5/..-G1-HT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, Standard component made of highly temperature resistant plastic; suitable for reflow process. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads".

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 14, number of rows: 2, number of positions: 7, number of connections: 14, product range: MCD 0,5/..-G1-HT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, Standard component made of highly temperature resistant plastic; suitable for reflow process. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads".

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 16, number of rows: 2, number of positions: 8, number of connections: 16, product range: MCD 0,5/..-G1-HT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, Standard component made of highly temperature resistant plastic; suitable for reflow process. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads".

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 18, number of rows: 2, number of positions: 9, number of connections: 18, product range: MCD 0,5/..-G1-HT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, Standard component made of highly temperature resistant plastic; suitable for reflow process. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads".

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 20, number of rows: 2, number of positions: 10, number of connections: 20, product range: MCD 0,5/..-G1-HT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.8 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, Standard component made of highly temperature resistant plastic; suitable for reflow process. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads".

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 4 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 24, number of rows: 2, number of positions: 12, number of connections: 24, product range: MCD 0,5/..-G1-HT, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON FK-MC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard

PCB headers, nominal cross section: 0.5 mm², color: signal white, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 2, number of rows: 1, number of positions: 2, number of connections: 2, product range: PTSM 0,5/..-HH-THR WH, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.1 mm, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 16 mm wide tape

PCB headers, nominal cross section: 0.5 mm², color: signal white, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: PTSM 0,5/..-HH-THR WH, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.1 mm, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 32 mm wide tape

PCB headers, nominal cross section: 0.5 mm², color: signal white, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 4, number of rows: 1, number of positions: 4, number of connections: 4, product range: PTSM 0,5/..-HH-THR WH, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.1 mm, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 32 mm wide tape

PCB headers, nominal cross section: 0.5 mm², color: signal white, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 5, number of rows: 1, number of positions: 5, number of connections: 5, product range: PTSM 0,5/..-HH-THR WH, pitch: 2.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.1 mm, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 32 mm wide tape