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| Product properties | Product type: SMD male connector Product family: FP 0,8/...-MH Number of positions: 12 Pitch: 0.8 mm Number of rows: 2 Pin layout: Linear pad geometry |
| Electrical properties | Nominal current IN: 1.7 A IEC 60512-5-2:2002-02 (at20°C 80-pos.) Degree of pollution: 3 Contact resistance: 25 mé Test voltage: 500 VAC IEC 60512-4-1:2003 |
| Mounting | Mounting type: SMD soldering Pin layout: Linear pad geometry Processing notes Process: Reflow soldering Moisture Sensitive Level: MSL 1 Classification temperature Tc: 260°C |
| Material specifications | Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: Selective coating Metal surface contact area (top layer): Gold (Au) Metal surface contact area (middle layer): Nickel (Ni) Metal surface soldering area (top layer): Tin (Sn) Metal surface soldering area (middle layer): Nickel (Ni) Material data - housing Color (Housing): black (9005) Insulating material: LCP Insulating material group: IIIb CTI according to IEC 60112: 150 Flammability rating according to UL 94: V0 |
| Notes | Notes on operation: The permissible voltage during operation depends on the application, taking into consideration the air clearances and creepage distances within the scope of insulation requirements in accordance with IEC 60664-1. Details for soldering processes: The items are suitable for assembly on both sides and for overhead soldering. |
| Dimensions | Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/70e0f23c282363459709fcfe7d5e7131/-S204x204-FJPG Pitch: 0.8 mm Width [w]: 9.2 mm Height [h]: 6.95 mm Length [l]: 9.36 mm Installed height: 6.45 mm Application Contact cover: 0.8 mm Center offset: ± 0.7 mm in longitudinal and transverse direction Wipe length: 1.5 mm Angular tolerance: ± 5° in longitudinal and transverse direction (when plugging in) ± 5° in longitudinal and transverse direction (when plugged in) Axial offset in X direction (longitudinal): ± 0.3 mm (Tolerance compensation when plugged in) Axial offset in Y direction (transversal): ± 0.3 mm (Tolerance compensation when plugged in) PCB design Pad geometry: 0.5 x 2.5 mm 0.5 x 2.7 mm |
| Electrical tests | Thermal test | Test group C Specification: IEC 60512-5-2:2002-02 Tested number of positions: 80 Insulation resistance Specification: IEC 60512-3-1:2002-02 Insulation resistance, neighboring positions: ⥠5 Gé Air clearances and creepage distances | Insulating material group: IIIb Minimum value for clearance and creepage distance: 0.25 mm |
| Environmental and real-life conditions | Vibration test Specification: IEC 60068-2-6:2007-12 Frequency: 10 - 2000 - 10 Hz Sweep speed: 1octave/min 200m/s² (58Hz...2000Hz) Amplitude: 1.5mm (10Hz...58Hz) Test duration per axis: 2.5 h Durability test Specification: IEC 60512-9-1:2010-03 (following) Contact resistance R1: 25 mé Contact resistance R2: 25 mé Insertion/withdrawal cycles: 500 Shocks Specification: IEC 60068-2-27:2008-02 Pulse shape: Semi-sinusoidal Acceleration: 490m/s² Shock duration: 11ms Test directions: X-, Y- and Z-axis (pos. and neg.) Ambient conditions Ambient temperature (operation): -55°C ... 125°C Ambient temperature (storage/transport): -40°C ... 70°C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5°C ... 100°C |
| Packaging specifications | Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/5c9d0417f989e646afbbef42108ede86/-S204x204-FJPG Type of packaging: 24 mm wide tape [W] tape width: 24 mm [W2] coil overall dimension: 30.4 mm [A] coil diameter: 330 mm Outer packaging type: Transparent-Bag ESD level: (D) electrostatically conductive Specification: DINEN61340-5-1 (VDE0300-5-1): 2008-07 |
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