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PHOENIX CONTACT 1009785
PHOENIX CONTACT 1009785
PHOENIX CONTACTNon disponibile

PTSM 0,5/ 8-2,5-V SMD R44 WP - PCB terminal block

PCB terminal block, nominal current: 6 A, rated voltage (III/2): 160 V, nominal cross section: 0.5 mm2, number of rows: 1, number of positions per row: 8, product range: PTSM 0,5/..-V-SMD, pitch: 2.5 mm, connection method: Push-in spring connection, mounting: SMD soldering, conductor/PCB connection direction: 90°, color: black, Pin layout: Linear pad geometry, number of solder pins per potential: 1, type of packaging: 44 mm wide tape
Cod. Articolo: 1009785
Cod. Fornitore: 1009785
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Caratteristiche Tecniche
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Caratteristiche Tecniche
Product propertiesProduct line: COMBICON Terminals XS
Product type: Printed circuit board terminal
Product family: PTSM 0,5/..-V-SMD
Number of positions: 8
Pitch: 2.5 mm
Number of rows: 1
Pin layout: Linear pad geometry
Solder pins per potential: 1
Electrical propertiesNominal current IN: 6 A
Nominal voltage UN: 160 V
Degree of pollution: 3
Rated voltage (III/3): 32 V
Rated surge voltage (III/3): 2.5 kV
Rated voltage (III/2): 160 V
Rated surge voltage (III/2): 2.5 kV
Rated voltage (II/2): 160 V
Rated surge voltage (II/2): 2.5 kV
Connection dataConnection technology
Nominal cross section: 0.5 mm²
Conductor connection
Connection method: Push-in spring connection
Conductor cross section rigid: 0.14 mm² ... 0.5 mm²
Conductor cross section flexible: 0.2 mm² ... 0.5 mm² (up to 0.75mm² supported, with a stripping length of 7.5mm and a rated insulation voltage of 32V at III/2)
Conductor cross section AWG: 26 ... 20
Conductor cross section flexible, with ferrule without plastic sleeve: 0.25 mm² ... 0.5 mm²
Conductor cross section, flexible, with ferrule, with plastic sleeve: 0.25 mm² ... 0.34 mm² (possible from 0.14mm², when using ferrule AI0.14-6GY in combination with crimping pliers CRIMPFOX 10T-F)
Cylindrical gauge a x b / diameter: - / 1.2mm
Stripping length: 6 mm
MountingMounting type: SMD soldering
Pin layout: Linear pad geometry
Processing notes
Process: Reflow soldering
Moisture Sensitive Level: MSL 1
Classification temperature Tc: 260°C
Solder cycles in the reflow: 3
Material specificationsMaterial data - contact
Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material: Cu alloy
Surface characteristics: hot-dip tin-plated
Metal surface terminal point (top layer): Tin (4 - 8 µm Sn)
Metal surface soldering area (top layer): Tin (4 - 8 µm Sn)
Material data - housing
Color (Housing): black (9005)
Insulating material: LCP
Insulating material group: IIIa
CTI according to IEC 60112: 175
Flammability rating according to UL 94: V0
NotesNote on application: Pick and place pads may protrude beyond the components. The PCB layout must ensure that collisions are avoided when components are assembled.
DimensionsDimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/158b0afe23d1ab408f646eacfe25f655/-S204x204-FJPG
Pitch: 2.5 mm
Width [w]: 25.1 mm
Height [h]: 9 mm
Length [l]: 7 mm
Installed height: 9 mm
PCB design
Pad geometry: 1.4 x 3.4 mm
Mechanical testsConnection test
Specification: IEC 60998-2-2:2002-12
Result: Test passed
Test for conductor damage and slackening
Specification: IEC 60998-2-2:2002-12
Result: Test passed
Pull-out test
Specification: IEC 60998-2-2:2002-12
Conductor cross section/conductor type/tractive force setpoint/actual value: 0.14 mm² / solid / > 10 N
0.2 mm² / flexible / > 10 N
0.5 mm² / solid / > 20 N
0.75 mm² / flexible / > 30 N
Flexion test
Specification: IEC 60998-2-2:2002-12
Result: Test passed
Insulation holder for crimp connections
Result: Test passed
Electrical testsTemperature-rise test
Specification: IEC 60998-2-1:2002-12
Requirement temperature-rise test: Increase in temperature ≤45K
Insulation resistance
Specification: IEC 60998-1:2002-12
Insulation resistance, neighboring positions: >5MΩ
Air clearances and creepage distances |
Specification: IEC 60664-1:2007-04
Insulating material group: IIIa
Comparative tracking index (IEC 60112): CTI ≥175 to <400
Rated insulation voltage (III/3): 32 V
Rated surge voltage (III/3): 2.5 kV
minimum clearance value - non-homogenous field (III/3): 1.5 mm
minimum creepage distance (III/3): 1.3 mm
Rated insulation voltage (III/2): 160 V
Rated surge voltage (III/2): 2.5 kV
minimum clearance value - non-homogenous field (III/2): 1.5 mm
minimum creepage distance (III/2): 1.6 mm
Rated insulation voltage (II/2): 160 V
Rated surge voltage (II/2): 2.5 kV
minimum clearance value - non-homogenous field (II/2): 1.5 mm
minimum creepage distance (II/2): 1.6 mm
Environmental and real-life conditionsVibration test
Specification: IEC 60068-2-6:2007-12
Frequency: 10 - 150 - 10 Hz
Sweep speed: 1octave/min
5g (60.1Hz...150Hz)
Amplitude: 0.35mm (10Hz...60.1Hz)
Test duration per axis: 2.5 h
Glow-wire test
Specification: IEC 60998-1:2002-12
Temperature: 850°C
Time of exposure: 5 s
Ambient conditions
Ambient temperature (operation): -40°C ... 100°C (Depending on the current carrying capacity/derating curve)
Ambient temperature (storage/transport): -40°C ... 70°C
Relative humidity (storage/transport): 30 % ... 70 %
Ambient temperature (assembly): -5°C ... 100°C
Packaging specificationsDimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/5c9d0417f989e646afbbef42108ede86/-S204x204-FJPG
Type of packaging: 44 mm wide tape
[W] tape width: 44 mm
[W2] coil overall dimension: 50.4 mm
[A] coil diameter: 330 mm
Outer packaging type: Transparent-Bag
ESD level: (D) electrostatically conductive
Specification: DINEN61340-5-1 (VDE0300-5-1): 2008-07
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PER SCARICARE I DOCUMENTI E' NECESSARIO EFFETTUARE L'ACCESSO AL SITO

Approvals_00507.pdf

Approvals_00546.pdf

Approvals_00605.pdf

Manufacturer_declaration_05483.pdf

Technical_drawing_05251.pdf

Technical_drawing_05252.pdf

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