Catalogo Prodotti - Technology Bsa

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 5, number of rows: 1, number of positions per row: 5, product range: TDPT 16/..-SP, pitch: 10.16 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 3.5 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: TDPT 16/..-SP, pitch: 10.16 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 3.5 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 3, number of rows: 1, number of positions per row: 3, product range: TDPT 16/..-SP, pitch: 10.16 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 3.5 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: TDPT 16/..-SP, pitch: 10.16 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 3.5 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard

PCB terminal block, nominal current: 125 A, rated voltage (III/2): 1000 V, nominal cross section: 35 mm², number of potentials: 5, number of rows: 1, number of positions per row: 5, product range: SPT 35/..-V, pitch: 15 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Linear pinning, Solder pin [P]: 5.9 mm, number of solder pins per potential: 4, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 7, number of rows: 1, number of positions per row: 7, product range: SPTA 16/, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 60°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 4.1 mm, number of solder pins per potential: 3, type of packaging: packed in cardboard

PCB terminal block, nominal current: 125 A, rated voltage (III/2): 1000 V, nominal cross section: 35 mm², number of potentials: 3, number of rows: 1, number of positions per row: 3, product range: SPT 35/..-V, pitch: 15 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Linear pinning, Solder pin [P]: 5.9 mm, number of solder pins per potential: 4, type of packaging: packed in cardboard

PCB terminal block, nominal current: 125 A, rated voltage (III/2): 1000 V, nominal cross section: 35 mm², number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: SPT 35/..-V, pitch: 15 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Linear pinning, Solder pin [P]: 5.9 mm, number of solder pins per potential: 4, type of packaging: packed in cardboard

PCB terminal block, nominal current: 125 A, rated voltage (III/2): 1000 V, nominal cross section: 35 mm², number of potentials: 1, number of rows: 1, number of positions per row: 1, product range: SPT 35/..-V, pitch: 15 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Linear pinning, Solder pin [P]: 5.9 mm, number of solder pins per potential: 4, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 4.1 mm, number of solder pins per potential: 3, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 9, number of rows: 1, number of positions per row: 9, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 4.1 mm, number of solder pins per potential: 3, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 8, number of rows: 1, number of positions per row: 8, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 4.1 mm, number of solder pins per potential: 3, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 7, number of rows: 1, number of positions per row: 7, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 4.1 mm, number of solder pins per potential: 3, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 6, number of rows: 1, number of positions per row: 6, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 4.1 mm, number of solder pins per potential: 3, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 1, number of rows: 1, number of positions per row: 1, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: blue, Pin layout: Linear pinning, Solder pin [P]: 4.1 mm, number of solder pins per potential: 6, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 1, number of rows: 1, number of positions per row: 1, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Linear pinning, Solder pin [P]: 4.1 mm, number of solder pins per potential: 6, type of packaging: packed in cardboard. The rated data refers to the corresponding component only. The air clearances and creepage distances from neighboring components must satisfy the corresponding application standards.

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 1, number of rows: 1, number of positions per row: 1, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: violet, Pin layout: Linear pinning, Solder pin [P]: 4.1 mm, number of solder pins per potential: 6, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: yellow green, Pin layout: Zigzag pinning W, Solder pin [P]: 4.1 mm, number of solder pins per potential: 3, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: multicolored, Pin layout: Zigzag pinning W, Solder pin [P]: 4.1 mm, number of solder pins per potential: 3, type of packaging: packed in cardboard

PCB terminal block, nominal current: 76 A, rated voltage (III/2): 1000 V, nominal cross section: 16 mm², number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: SPT 16/..-V, pitch: 10 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 90°, color: green, Pin layout: Zigzag pinning W, Solder pin [P]: 4.1 mm, number of solder pins per potential: 3, type of packaging: packed in cardboard